diff --git a/Hardware/BOM.ods b/Hardware/BOM.ods
index 2d71818..0159df7 100644
Binary files a/Hardware/BOM.ods and b/Hardware/BOM.ods differ
diff --git a/Hardware/VNA.brd b/Hardware/VNA.brd
index 96cd60e..c32fd5d 100644
--- a/Hardware/VNA.brd
+++ b/Hardware/VNA.brd
@@ -6,7 +6,7 @@
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-+3V3
-+3V3
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Port 1
Ref In
Ref Out
-+12V In
++5V In
TX
NRST
SWDIO
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-+12V In
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++5V In
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@@ -1639,58 +1670,6 @@ by exp-lbrs.ulp
>NAME
>VALUE
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-32-QFN, 0.50 mm pitch, 5.00 X 5.00 X 1.00 mm body, 3.45 X 3.45 mm thermal pad
-<p>32-pin QFN package with 0.50 mm pitch with body size 5.00 X 5.00 X 1.00 mm and thermal pad size 3.45 X 3.45 mm</p>
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->NAME
->VALUE
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<b>DC POWER JACK</b><p>
Source: DCJ0202.pdf
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>NAME
>VALUE
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+16-SON (DFN), 0.50 mm pitch, 5.00 X 4.00 X 0.80 mm body, 4.00 X 2.60 mm thermal pad
+<p>16-pin SON (DFN) package with 0.50 mm pitch with body size 5.00 X 4.00 X 0.80 mm and thermal pad size 4.00 X 2.60 mm</p>
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+>NAME
+>VALUE
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+12-SON (DFN), 0.50 mm pitch, 3.00 X 3.00 X 0.90 mm body, 2.40 X 1.70 mm thermal pad
+<p>12-pin SON (DFN) package with 0.50 mm pitch with body size 3.00 X 3.00 X 0.90 mm and thermal pad size 2.40 X 1.70 mm</p>
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+>NAME
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@@ -3107,14 +3146,7 @@ Source: http://www.cypressindustries.com/pdf/32005-301.pdf
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-32-QFN, 0.50 mm pitch, 5.00 X 5.00 X 1.00 mm body, 3.45 X 3.45 mm thermal pad
-<p>32-pin QFN package with 0.50 mm pitch with body size 5.00 X 5.00 X 1.00 mm and thermal pad size 3.45 X 3.45 mm</p>
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<b>DC POWER JACK</b><p>
Source: DCJ0202.pdf
@@ -3310,6 +3342,20 @@ Source: http://www.cypressindustries.com/pdf/32005-301.pdf
+
+16-SON (DFN), 0.50 mm pitch, 5.00 X 4.00 X 0.80 mm body, 4.00 X 2.60 mm thermal pad
+<p>16-pin SON (DFN) package with 0.50 mm pitch with body size 5.00 X 4.00 X 0.80 mm and thermal pad size 4.00 X 2.60 mm</p>
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+
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+12-SON (DFN), 0.50 mm pitch, 3.00 X 3.00 X 0.90 mm body, 2.40 X 1.70 mm thermal pad
+<p>12-pin SON (DFN) package with 0.50 mm pitch with body size 3.00 X 3.00 X 0.90 mm and thermal pad size 2.40 X 1.70 mm</p>
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