diff --git a/Hardware/VNA.lbr b/Hardware/VNA.lbr new file mode 100644 index 0000000..0ce6808 --- /dev/null +++ b/Hardware/VNA.lbr @@ -0,0 +1,5428 @@ + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + +Generated from <b>VNA.sch</b><p> +by exp-lbrs.ulp + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + +>NAME +>VALUE + + +16-SON (DFN), 0.50 mm pitch, 5.00 X 4.00 X 0.80 mm body, 4.00 X 2.60 mm thermal pad +<p>16-pin SON (DFN) package with 0.50 mm pitch with body size 5.00 X 4.00 X 0.80 mm and thermal pad size 4.00 X 2.60 mm</p> + + + + + + + + + + + + + + + + + + + + + + + + + + + + +>NAME +>VALUE + + +20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.75 mm body, 2.06 X 2.06 mm thermal pad +<p>20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.75 mm and thermal pad size 2.06 X 2.06 mm</p> + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + +>NAME +>VALUE + + +20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.90 mm body, 2.70 X 2.70 mm thermal pad +<p>20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.90 mm and thermal pad size 2.70 X 2.70 mm</p> + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + +>NAME +>VALUE + + +<b>SMALL OUTLINE INTEGRATED CIRCUIT</b><p> +150 mil (3.9 mm) body/JEDEC MS-012AA + + + + + + + + + + + + + + + + + + + + + + + + + +>NAME +>VALUE + + +<b>SMA 50 Ohm</b> Board Thickness <b>0.062</b> Inch, End Launch Jack Receptacle<p> +Johnson Components<br> +Source: www.johnsoncomponents.com .. 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The URNs of those assets +will not be understood (or retained) with this version. + + +Since Version 8.3, EAGLE supports the association of 3D packages +with devices in libraries, schematics, and board files. Those 3D +packages will not be understood (or retained) with this version. + + +