Generated from VNA.sch by exp-lbrs.ulp CAPACITOR >NAME >VALUE >NAME >VALUE CAPACITOR >NAME >VALUE CAPACITOR >NAME >VALUE DIODE >NAME >VALUE 6-SON (DFN), 0.95 mm pitch, 3.00 X 3.00 X 1.00 mm body, 2.40 X 1.70 mm thermal pad 6-pin SON (DFN) package with 0.95 mm pitch with body size 3.00 X 3.00 X 1.00 mm and thermal pad size 2.40 X 1.70 mm >NAME >VALUE RESISTOR >NAME >VALUE >Name >Value RESISTOR >NAME >VALUE TEST PAD >NAME >VALUE >TP_SIGNAL_NAME 20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.90 mm body, 2.70 X 2.70 mm thermal pad 20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.90 mm and thermal pad size 2.70 X 2.70 mm >NAME >VALUE SMA 50 Ohm Board Thickness 0.062 Inch, End Launch Jack Receptacle Johnson Components Source: www.johnsoncomponents.com .. J502-ND.pdf >NAME >VALUE 32-QFN, 0.50 mm pitch, 5.00 X 5.00 X 0.80 mm body, 3.10 X 3.10 mm thermal pad 32-pin QFN package with 0.50 mm pitch with body size 5.00 X 5.00 X 0.80 mm and thermal pad size 3.10 X 3.10 mm >NAME >VALUE 5-SOT23, 0.95 mm pitch, 2.40 mm span, 2.90 X 1.30 X 1.10 mm body 5-pin SOT23 package with 0.95 mm pitch, 2.40 mm span with body size 2.90 X 1.30 X 1.10 mm >NAME >VALUE 12-QFN, 0.40 mm pitch, 1.80 X 1.80 X 0.55 mm body, 0.76 X 0.76 mm thermal pad 12-pin QFN package with 0.40 mm pitch with body size 1.80 X 1.80 X 0.55 mm and thermal pad size 0.76 X 0.76 mm >NAME >VALUE 4-SOT223, 2.30 mm pitch, 7.00 mm span, 6.50 X 3.50 X 1.80 mm body 4-pin SOT223 package with 2.30 mm pitch, 7.00 mm span with body size 6.50 X 3.50 X 1.80 mm >NAME >VALUE DFN4, 1.60 X 0.84 X 0.70 mm body DFN4 package with body size 1.60 X 0.84 X 0.70 mm >NAME >VALUE 20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.75 mm body, 2.06 X 2.06 mm thermal pad 20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.75 mm and thermal pad size 2.06 X 2.06 mm >NAME >VALUE 24-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.75 mm body, 2.70 X 2.70 mm thermal pad 24-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.75 mm and thermal pad size 2.70 X 2.70 mm >NAME >VALUE 8-SON (DFN), 0.50 mm pitch, 2.00 X 2.00 X 0.80 mm body, 1.60 X 0.90 mm thermal pad 8-pin SON (DFN) package with 0.50 mm pitch with body size 2.00 X 2.00 X 0.80 mm and thermal pad size 1.60 X 0.90 mm >NAME >VALUE 8-SON, 0.50 mm pitch, 3.00 X 3.00 X 0.80 mm body, 2.38 X 1.65 mm thermal pad 8-pin SON package with 0.50 mm pitch with body size 3.00 X 3.00 X 0.80 mm and thermal pad size 2.38 X 1.65 mm >NAME >VALUE 8-SOP, 0.65 mm pitch, 4.90 mm span, 3.00 X 3.00 X 1.10 mm body 8-pin SOP package with 0.65 mm pitch, 4.90 mm span with body size 3.00 X 3.00 X 1.10 mm >NAME >VALUE 10-SOP, 0.50 mm pitch, 4.90 mm span, 3.00 X 3.00 X 1.10 mm body 10-pin SOP package with 0.50 mm pitch, 4.90 mm span with body size 3.00 X 3.00 X 1.10 mm >NAME >VALUE 24-QFN, 0.50 mm pitch, 4.00 X 4.00 X 1.00 mm body, 2.50 X 2.50 mm thermal pad 24-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 1.00 mm and thermal pad size 2.50 X 2.50 mm >NAME >VALUE >NAME >VALUE >Name >Value 48-QFN, 0.50 mm pitch, 7.00 X 7.00 X 0.60 mm body, 5.60 X 5.60 mm thermal pad 48-pin QFN package with 0.50 mm pitch with body size 7.00 X 7.00 X 0.60 mm and thermal pad size 5.60 X 5.60 mm >NAME >VALUE PIN HEADER >NAME >VALUE CHIPLED Source: http://www.osram.convergy.de/ ... LG_LY Q971.pdf >NAME >VALUE TQ144 TQG144 >NAME >VALUE SMALL OUTLINE INTEGRATED CIRCUIT 150 mil (3.9 mm) body/JEDEC MS-012AA >NAME >VALUE PIN HEADER >NAME >VALUE 16-SON (DFN), 0.50 mm pitch, 5.00 X 4.00 X 0.80 mm body, 4.00 X 2.60 mm thermal pad 16-pin SON (DFN) package with 0.50 mm pitch with body size 5.00 X 4.00 X 0.80 mm and thermal pad size 4.00 X 2.60 mm >NAME >VALUE 12-SON (DFN), 0.50 mm pitch, 3.00 X 3.00 X 0.90 mm body, 2.40 X 1.70 mm thermal pad 12-pin SON (DFN) package with 0.50 mm pitch with body size 3.00 X 3.00 X 0.90 mm and thermal pad size 2.40 X 1.70 mm >NAME >VALUE >Name >Value 3-SOTFL, 0.95 mm pitch, 2.40 mm span, 2.90 X 1.80 X 0.80 mm body 3-pin SOTFL package with 0.95 mm pitch, 2.40 mm span with body size 2.90 X 1.80 X 0.80 mm >NAME >VALUE Chip, 2.00 X 1.25 X 1.00 mm body Chip package with body size 2.00 X 1.25 X 1.00 mm >NAME >VALUE CAPACITOR CAPACITOR CAPACITOR DIODE 6-SON (DFN), 0.95 mm pitch, 3.00 X 3.00 X 1.00 mm body, 2.40 X 1.70 mm thermal pad 6-pin SON (DFN) package with 0.95 mm pitch with body size 3.00 X 3.00 X 1.00 mm and thermal pad size 2.40 X 1.70 mm RESISTOR RESISTOR TEST PAD 20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.90 mm body, 2.70 X 2.70 mm thermal pad 20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.90 mm and thermal pad size 2.70 X 2.70 mm SMA 50 Ohm Board Thickness 0.062 Inch, End Launch Jack Receptacle Johnson Components Source: www.johnsoncomponents.com .. J502-ND.pdf 32-QFN, 0.50 mm pitch, 5.00 X 5.00 X 0.80 mm body, 3.10 X 3.10 mm thermal pad 32-pin QFN package with 0.50 mm pitch with body size 5.00 X 5.00 X 0.80 mm and thermal pad size 3.10 X 3.10 mm 5-SOT23, 0.95 mm pitch, 2.40 mm span, 2.90 X 1.30 X 1.10 mm body 5-pin SOT23 package with 0.95 mm pitch, 2.40 mm span with body size 2.90 X 1.30 X 1.10 mm 12-QFN, 0.40 mm pitch, 1.80 X 1.80 X 0.55 mm body, 0.76 X 0.76 mm thermal pad 12-pin QFN package with 0.40 mm pitch with body size 1.80 X 1.80 X 0.55 mm and thermal pad size 0.76 X 0.76 mm 4-SOT223, 2.30 mm pitch, 7.00 mm span, 6.50 X 3.50 X 1.80 mm body 4-pin SOT223 package with 2.30 mm pitch, 7.00 mm span with body size 6.50 X 3.50 X 1.80 mm DFN4, 1.60 X 0.84 X 0.70 mm body DFN4 package with body size 1.60 X 0.84 X 0.70 mm 20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.75 mm body, 2.06 X 2.06 mm thermal pad 20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.75 mm and thermal pad size 2.06 X 2.06 mm 24-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.75 mm body, 2.70 X 2.70 mm thermal pad 24-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.75 mm and thermal pad size 2.70 X 2.70 mm 8-SON (DFN), 0.50 mm pitch, 2.00 X 2.00 X 0.80 mm body, 1.60 X 0.90 mm thermal pad 8-pin SON (DFN) package with 0.50 mm pitch with body size 2.00 X 2.00 X 0.80 mm and thermal pad size 1.60 X 0.90 mm 8-SON, 0.50 mm pitch, 3.00 X 3.00 X 0.80 mm body, 2.38 X 1.65 mm thermal pad 8-pin SON package with 0.50 mm pitch with body size 3.00 X 3.00 X 0.80 mm and thermal pad size 2.38 X 1.65 mm 8-SOP, 0.65 mm pitch, 4.90 mm span, 3.00 X 3.00 X 1.10 mm body 8-pin SOP package with 0.65 mm pitch, 4.90 mm span with body size 3.00 X 3.00 X 1.10 mm 10-SOP, 0.50 mm pitch, 4.90 mm span, 3.00 X 3.00 X 1.10 mm body 10-pin SOP package with 0.50 mm pitch, 4.90 mm span with body size 3.00 X 3.00 X 1.10 mm 24-QFN, 0.50 mm pitch, 4.00 X 4.00 X 1.00 mm body, 2.50 X 2.50 mm thermal pad 24-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 1.00 mm and thermal pad size 2.50 X 2.50 mm 48-QFN, 0.50 mm pitch, 7.00 X 7.00 X 0.60 mm body, 5.60 X 5.60 mm thermal pad 48-pin QFN package with 0.50 mm pitch with body size 7.00 X 7.00 X 0.60 mm and thermal pad size 5.60 X 5.60 mm PIN HEADER CHIPLED Source: http://www.osram.convergy.de/ ... LG_LY Q971.pdf TQ144 TQG144 SMALL OUTLINE INTEGRATED CIRCUIT 150 mil (3.9 mm) body/JEDEC MS-012AA PIN HEADER 16-SON (DFN), 0.50 mm pitch, 5.00 X 4.00 X 0.80 mm body, 4.00 X 2.60 mm thermal pad 16-pin SON (DFN) package with 0.50 mm pitch with body size 5.00 X 4.00 X 0.80 mm and thermal pad size 4.00 X 2.60 mm 12-SON (DFN), 0.50 mm pitch, 3.00 X 3.00 X 0.90 mm body, 2.40 X 1.70 mm thermal pad 12-pin SON (DFN) package with 0.50 mm pitch with body size 3.00 X 3.00 X 0.90 mm and thermal pad size 2.40 X 1.70 mm 3-SOTFL, 0.95 mm pitch, 2.40 mm span, 2.90 X 1.80 X 0.80 mm body 3-pin SOTFL package with 0.95 mm pitch, 2.40 mm span with body size 2.90 X 1.80 X 0.80 mm Chip, 2.00 X 1.25 X 1.00 mm body Chip package with body size 2.00 X 1.25 X 1.00 mm >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >DRAWING_NAME >LAST_DATE_TIME >SHEET Sheet: >VALUE >Name >Value >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >VALUE >VALUE >VALUE >VALUE >NAME >TP_SIGNAL_NAME >VALUE INT >Name >Value >VALUE >NAME >Name >Value >NAME >VALUE GND >Name >Value >NAME >VALUE GND >Name >Value >Name >Value >Name >Value >Name >Value >Name >Value >NAME >VALUE V+ V- >Name >Value >Name >Value >VALUE >NAME >Name >Value >Name >Value >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >Name >Value >Name >Value >Name >Value >VALUE >NAME SUPPLY SYMBOL CAPACITOR, European symbol CAPACITOR, European symbol CAPACITOR, European symbol DIODE FRAME DIN A3, landscape with location and doc. field SUPPLY SYMBOL RESISTOR, European symbol SUPPLY SYMBOL SUPPLY SYMBOL SUPPLY SYMBOL SUPPLY SYMBOL Test pad SUPPLY SYMBOL PIN HEADER LED OSRAM: - CHIPLED LG R971, LG N971, LY N971, LG Q971, LY Q971, LO R971, LY R971 LH N974, LH R974 LS Q976, LO Q976, LY Q976 LO Q996 - Hyper CHIPLED LW Q18S LB Q993, LB Q99A, LB R99A - SideLED LS A670, LO A670, LY A670, LG A670, LP A670 LB A673, LV A673, LT A673, LW A673 LH A674 LY A675 LS A676, LA A676, LO A676, LY A676, LW A676 LS A679, LY A679, LG A679 - Hyper Micro SIDELED® LS Y876, LA Y876, LO Y876, LY Y876 LT Y87S - SmartLED LW L88C, LW L88S LB L89C, LB L89S, LG L890 LS L89K, LO L89K, LY L89K LS L896, LA L896, LO L896, LY L896 - TOPLED LS T670, LO T670, LY T670, LG T670, LP T670 LSG T670, LSP T670, LSY T670, LOP T670, LYG T670 LG T671, LOG T671, LSG T671 LB T673, LV T673, LT T673, LW T673 LH T674 LS T676, LA T676, LO T676, LY T676, LB T676, LH T676, LSB T676, LW T676 LB T67C, LV T67C, LT T67C, LS T67K, LO T67K, LY T67K, LW E67C LS E67B, LA E67B, LO E67B, LY E67B, LB E67C, LV E67C, LT E67C LW T67C LS T679, LY T679, LG T679 LS T770, LO T770, LY T770, LG T770, LP T770 LB T773, LV T773, LT T773, LW T773 LH T774 LS E675, LA E675, LY E675, LS T675 LS T776, LA T776, LO T776, LY T776, LB T776 LHGB T686 LT T68C, LB T68C - Hyper Mini TOPLED® LB M676 - Mini TOPLED Santana® LG M470 LS M47K, LO M47K, LY M47K Source: http://www.osram.convergy.de LUXEON: - LUMILED® LXK2-PW12-R00, LXK2-PW12-S00, LXK2-PW14-U00, LXK2-PW14-V00 LXK2-PM12-R00, LXK2-PM12-S00, LXK2-PM14-U00 LXK2-PE12-Q00, LXK2-PE12-R00, LXK2-PE12-S00, LXK2-PE14-T00, LXK2-PE14-U00 LXK2-PB12-K00, LXK2-PB12-L00, LXK2-PB12-M00, LXK2-PB14-N00, LXK2-PB14-P00, LXK2-PB14-Q00 LXK2-PR12-L00, LXK2-PR12-M00, LXK2-PR14-Q00, LXK2-PR14-R00 LXK2-PD12-Q00, LXK2-PD12-R00, LXK2-PD12-S00 LXK2-PH12-R00, LXK2-PH12-S00 LXK2-PL12-P00, LXK2-PL12-Q00, LXK2-PL12-R00 Source: www.luxeon.com KINGBRIGHT: KA-3528ASYC Source: www.kingbright.com Xilinx FPGA: 6SLX9TQG144 EEPROM 4 Mbit SPI Serial Flash7 PIN HEADER Supply Symbols GND, VCC, 0V, +5V, -5V, etc. Please keep in mind, that these devices are necessary for the automatic wiring of the supply signals. The pin name defined in the symbol is identical to the net which is to be wired automatically. In this library the device names are the same as the pin names of the symbols, therefore the correct signal names appear next to the supply symbols in the schematic. <author>Created by librarian@cadsoft.de</author> >VALUE SUPPLY SYMBOL <big>GEYER ELECTRONIC --- Your producer for quartz crystals and oscillators</big> <Hr> Version 1.0, 07.06.2016 <hr> <a href="http://www.geyer-electronic.de/fileadmin/template/img/logo-geyer-electronic.png" title="Enlarge picture"> <img src="http://www.geyer-electronic.de/fileadmin/template/img/logo-geyer-electronic.png" width="320"></a> <HR> GEYER ELECTRONIC e.K. Lochhamer Schlag 5 D-82166 Gräfelfing/München Tel: +49 89 546868-0 Fax: +49 89 546868-90 für Batterien und Ladetechnik Fax: +49 89 546868-91 für Quarzprodukte <a href="http://www.geyer-electronic.de">http://www.geyer-electronic.de</a> <a href="mailto:info@geyer-electronic.de">info@geyer-electronic.de</a> <HR> Neither CadSoft nor Geyer-Electronic does warrant that this library is error-free or that it meets your specific requirements. Please contact us for more information. <HR> Copyright: Geyer-Electronic 4 Pad >NAME >VALUE KXO RG 86 4 Pad >NAME >VALUE KXO-84 RG 4 Pad >NAME >VALUE KXO-83 RG 4 Pad >NAME >VALUE KXO-82 RG 4 Pad 4 Pad 4 Pad 4 Pad >NAME OUT GND VDD GND/NC <table border=0 cellspacing=0 cellpadding=0 width="80%" cellpaddding=0> <tr valign="top"> <! <td width="10"> </td> <td width="90%"> <th> <big> TCXO :</big>  CMOS - Serie </th> <TABLE BORDER=1 CELLSPACING=2 CELLPADDING=2> <TR> <TD COLSPAN=8>  </TD> </TR> <TR> <TD ALIGN=CENTER> Model </TD> <TD ALIGN=CENTER> Size l/w/h [mm] </TD> <TD ALIGN=CENTER> Frequency Range </TD> <TD ALIGN=CENTER> Frequency Stability </TD> <TD ALIGN=CENTER> Temp. Range [°C] </TD> <TD ALIGN=CENTER> Output </TD> <TD ALIGN=CENTER> AECQ 200 availabel </TD> <TD ALIGN=CENTER> Datasheet </TD> </TR> <TR> <TD BGCOLOR="#cccccc" ALIGN=CENTER> KXO-86 KXO-84 KXO-83 KXO-82 </TD> <TD BGCOLOR="#cccccc" ALIGN=CENTER> 2.5/2.0/0.7 3.2/2.5/1.0 5.0/3.2/1.5 7.0/5.0/2.4 </TD> <TD BGCOLOR="#cccccc" ALIGN=CENTER> 13,0 ~ 40,0 MHz 10,0 ~ 40,0 MHz 10,0 ~ 40,0 MHz 10,0 ~ 30,0 MHz </TD> <TD BGCOLOR="#cccccc" ALIGN=CENTER> ±1,0 … ±2,5ppm ±1,0 … ±2,5ppm ±1,0 … ±3,0ppm ±1,0 … ±3,0ppm </TD> <TD BGCOLOR="#cccccc" ALIGN=CENTER> (*) -30°C …+75°C (*) -40°C …+85°C (*) -40°C …+85°C (*) -30°C …+80°C </TD> <TD BGCOLOR="#cccccc" ALIGN=CENTER> CMOS CMOS CMOS CMOS </TD> <TD BGCOLOR="#cccccc" ALIGN=CENTER> - - - - </TD> <TD BGCOLOR="#cccccc" ALIGN=CENTER> <a href="http://www.geyer-electronic.de/uploads/tx_userartikelfrequenz/GEYER-KXO-86-TCXO-HCMOS.pdf">KXO-86.pdf</a> <a href="http://www.geyer-electronic.de/uploads/tx_userartikelfrequenz/GEYER-KXO-84-TCXO-HCMOS.pdf">KXO-84.pdf</a> <a href="http://www.geyer-electronic.de/uploads/tx_userartikelfrequenz/GEYER-KXO-83-TCXO-HCMOS.pdf">KXO-83.pdf</a> <a href="http://www.geyer-electronic.de/uploads/tx_userartikelfrequenz/GEYER-KXO-82-TCXO-HCMOS.pdf">KXO-82.pdf</a> </TD> </TR> </TABLE> </td> </tr> </table> <a href="http://www.geyer-electronic.de/fileadmin/template/img/logo-geyer-electronic.png" title="Enlarge picture"> <img src="http://www.geyer-electronic.de/fileadmin/template/img/logo-geyer-electronic.png" width="150"></a> Details see: <a href="http://www.geyer-electronic.de/Frequenz-Produkte.9.0.html">http://www.geyer-electronic.de/Frequenz-Produkte.9.0.html</a> Created 2016-06-07, Hans Locher 2016 (C) Geyer Quartz Technology  KXO86,KXO84,KXO83,KXO82;2550;3225;5032;7050;2,5x2,0;3,2x2,5;2.5x2.0;3.2x2.5,5,0x3,2;7,0x5,0,5.0x3.2,7.0x5.0 Port 1 Mixers, up to 200mA Port 2 Mixers, up to 200mA Reference Mixers, up to 200mA Source and 1.LO, up to 350mA I2C address: 0x42 Power Supply CLK Generation Reference CLK and 2.LO Up to 100mA 40MHz lowpass I2C address: 0xC0 Source up to 200mA current consumption All I/O using 3V3 levels 3x 3V3 Approx. 450kHz loop bandwidth 5dbm ca. -1db ca. -1db ca. 2dbm C1/C2 should not be driven above 1.8V HF Source Serial interface not used ca. 2dbm -0.5db ca. -30 to 0dbm Up to 60mA on 3V3 Attenuator/Amplifier/Switches 1. LO up to 200mA current consumption All I/O using 3V3 levels 3x 3V3 Approx. 450kHz loop bandwidth 1.LO Port 1 P1db: 0dbm -3db pad Return loss bridge Downconverter to 1.IF (ca. 60MHz) 60MHz lowpass and conversion from 250 Ohm to 28 Ohm impedance -10db pad (28 Ohm impedance) Downconverter to 1.IF (ca. 250kHz) Final IF amplifier and ADC driver 300kHz lowpass 1MS/s ADC Port 1 Port 2 P1db: 0dbm -3db pad Return loss bridge Downconverter to 1.IF (ca. 60MHz) 60MHz lowpass and conversion from 250 Ohm to 28 Ohm impedance -10db pad (28 Ohm impedance) Downconverter to 1.IF (ca. 250kHz) Final IF amplifier and ADC driver 300kHz lowpass 1MS/s ADC Port 2 Ref Signal Reference Signal FPGA + MCU Connections Place resistors for FPGA master configuration Place resistors for FPGA slave configuration FPGA Connections Since Version 6.2.2 text objects can contain more than one line, which will not be processed correctly with this version. Since Version 8.2, EAGLE supports online libraries. The ids of those online libraries will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports URNs for individual library assets (packages, symbols, and devices). The URNs of those assets will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports the association of 3D packages with devices in libraries, schematics, and board files. Those 3D packages will not be understood (or retained) with this version.