Generated from <b>VNA.sch</b><p> by exp-lbrs.ulp >NAME >VALUE 16-SON (DFN), 0.50 mm pitch, 5.00 X 4.00 X 0.80 mm body, 4.00 X 2.60 mm thermal pad <p>16-pin SON (DFN) package with 0.50 mm pitch with body size 5.00 X 4.00 X 0.80 mm and thermal pad size 4.00 X 2.60 mm</p> >NAME >VALUE 20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.75 mm body, 2.06 X 2.06 mm thermal pad <p>20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.75 mm and thermal pad size 2.06 X 2.06 mm</p> >NAME >VALUE 20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.90 mm body, 2.70 X 2.70 mm thermal pad <p>20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.90 mm and thermal pad size 2.70 X 2.70 mm</p> >NAME >VALUE <b>SMALL OUTLINE INTEGRATED CIRCUIT</b><p> 150 mil (3.9 mm) body/JEDEC MS-012AA >NAME >VALUE <b>SMA 50 Ohm</b> Board Thickness <b>0.062</b> Inch, End Launch Jack Receptacle<p> Johnson Components<br> Source: www.johnsoncomponents.com .. J502-ND.pdf >NAME >VALUE 10-SOP, 0.50 mm pitch, 4.90 mm span, 3.00 X 3.00 X 1.10 mm body <p>10-pin SOP package with 0.50 mm pitch, 4.90 mm span with body size 3.00 X 3.00 X 1.10 mm</p> >NAME >VALUE Chip, 2.00 X 1.25 X 1.00 mm body <p>Chip package with body size 2.00 X 1.25 X 1.00 mm</p> >NAME >VALUE 32-QFN, 0.50 mm pitch, 5.00 X 5.00 X 0.80 mm body, 3.10 X 3.10 mm thermal pad <p>32-pin QFN package with 0.50 mm pitch with body size 5.00 X 5.00 X 0.80 mm and thermal pad size 3.10 X 3.10 mm</p> >NAME >VALUE >Name >Value <b><b>MHZ RANGE CRYSTASL UNIT</b></b> FA-128<p> ULTRA MINIATURE SIZE LOW PROFILE SMD<br> Source: Epson Toyocom FA128.pdf >NAME >VALUE 5-SOT23, 0.95 mm pitch, 2.40 mm span, 2.90 X 1.30 X 1.10 mm body <p>5-pin SOT23 package with 0.95 mm pitch, 2.40 mm span with body size 2.90 X 1.30 X 1.10 mm</p> >NAME >VALUE <b>RESISTOR</b> >NAME >VALUE <b>RESISTOR</b> >NAME >VALUE 8-SON (DFN), 0.50 mm pitch, 2.00 X 2.00 X 0.80 mm body, 1.60 X 0.90 mm thermal pad <p>8-pin SON (DFN) package with 0.50 mm pitch with body size 2.00 X 2.00 X 0.80 mm and thermal pad size 1.60 X 0.90 mm</p> >NAME >VALUE <b>TEST PAD</b> >NAME >VALUE >TP_SIGNAL_NAME <b>CHIPLED</b><p> Source: http://www.osram.convergy.de/ ... LG_LY Q971.pdf >NAME >VALUE <b>DC POWER JACK</b><p> Source: DCJ0202.pdf >NAME >VALUE <b>DIODE</b> >NAME >VALUE 32-QFN, 0.50 mm pitch, 5.00 X 5.00 X 1.00 mm body, 3.45 X 3.45 mm thermal pad <p>32-pin QFN package with 0.50 mm pitch with body size 5.00 X 5.00 X 1.00 mm and thermal pad size 3.45 X 3.45 mm</p> >NAME >VALUE 4-SOT223, 2.30 mm pitch, 7.00 mm span, 6.50 X 3.50 X 1.80 mm body <p>4-pin SOT223 package with 2.30 mm pitch, 7.00 mm span with body size 6.50 X 3.50 X 1.80 mm</p> >NAME >VALUE <b>CAPACITOR</b> >NAME >VALUE >NAME >VALUE <b>PIN HEADER</b> >NAME >VALUE <b>TQ144 TQG144</b> >NAME >VALUE 12-SON (DFN), 0.50 mm pitch, 3.00 X 3.00 X 0.90 mm body, 2.40 X 1.70 mm thermal pad <p>12-pin SON (DFN) package with 0.50 mm pitch with body size 3.00 X 3.00 X 0.90 mm and thermal pad size 2.40 X 1.70 mm</p> >NAME >VALUE 8-SOP, 0.65 mm pitch, 4.90 mm span, 3.00 X 3.00 X 1.10 mm body <p>8-pin SOP package with 0.65 mm pitch, 4.90 mm span with body size 3.00 X 3.00 X 1.10 mm</p> >NAME >VALUE >Name >Value 6-SON (DFN), 0.95 mm pitch, 3.00 X 3.00 X 1.00 mm body, 2.40 X 1.70 mm thermal pad <p>6-pin SON (DFN) package with 0.95 mm pitch with body size 3.00 X 3.00 X 1.00 mm and thermal pad size 2.40 X 1.70 mm</p> >NAME >VALUE 12-QFN, 0.40 mm pitch, 1.80 X 1.80 X 0.55 mm body, 0.76 X 0.76 mm thermal pad <p>12-pin QFN package with 0.40 mm pitch with body size 1.80 X 1.80 X 0.55 mm and thermal pad size 0.76 X 0.76 mm</p> >NAME >VALUE <b>CAPACITOR</b> >NAME >VALUE >NAME >VALUE 48-QFN, 0.50 mm pitch, 7.00 X 7.00 X 0.60 mm body, 5.60 X 5.60 mm thermal pad <p>48-pin QFN package with 0.50 mm pitch with body size 7.00 X 7.00 X 0.60 mm and thermal pad size 5.60 X 5.60 mm</p> >NAME >VALUE <b>MINI USB-B R/A SMT W/O REAR</b><p> Source: http://www.cypressindustries.com/pdf/32005-301.pdf >NAME >VALUE DFN4, 1.60 X 0.84 X 0.70 mm body <p>DFN4 package with body size 1.60 X 0.84 X 0.70 mm</p> >NAME >VALUE 36-QFN, 0.50 mm pitch, 6.00 X 6.00 X 1.00 mm body, 4.10 X 4.10 mm thermal pad <p>36-pin QFN package with 0.50 mm pitch with body size 6.00 X 6.00 X 1.00 mm and thermal pad size 4.10 X 4.10 mm</p> >NAME >VALUE >Name >Value 24-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.75 mm body, 2.70 X 2.70 mm thermal pad <p>24-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.75 mm and thermal pad size 2.70 X 2.70 mm</p> >NAME >VALUE 3-SOTFL, 0.95 mm pitch, 2.40 mm span, 2.90 X 1.80 X 0.80 mm body <p>3-pin SOTFL package with 0.95 mm pitch, 2.40 mm span with body size 2.90 X 1.80 X 0.80 mm</p> >NAME >VALUE 24-QFN, 0.50 mm pitch, 4.00 X 4.00 X 1.00 mm body, 2.50 X 2.50 mm thermal pad <p>24-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 1.00 mm and thermal pad size 2.50 X 2.50 mm</p> >NAME >VALUE <b>CAPACITOR</b> >NAME >VALUE 8-SON, 0.50 mm pitch, 3.00 X 3.00 X 0.80 mm body, 2.38 X 1.65 mm thermal pad <p>8-pin SON package with 0.50 mm pitch with body size 3.00 X 3.00 X 0.80 mm and thermal pad size 2.38 X 1.65 mm</p> >NAME >VALUE <b>PIN HEADER</b> >NAME >VALUE >Name >Value >NAME >VALUE 20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.75 mm body, 2.06 X 2.06 mm thermal pad <p>20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.75 mm and thermal pad size 2.06 X 2.06 mm</p> 16-SON (DFN), 0.50 mm pitch, 5.00 X 4.00 X 0.80 mm body, 4.00 X 2.60 mm thermal pad <p>16-pin SON (DFN) package with 0.50 mm pitch with body size 5.00 X 4.00 X 0.80 mm and thermal pad size 4.00 X 2.60 mm</p> 20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.90 mm body, 2.70 X 2.70 mm thermal pad <p>20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.90 mm and thermal pad size 2.70 X 2.70 mm</p> <b>SMALL OUTLINE INTEGRATED CIRCUIT</b><p> 150 mil (3.9 mm) body/JEDEC MS-012AA 10-SOP, 0.50 mm pitch, 4.90 mm span, 3.00 X 3.00 X 1.10 mm body <p>10-pin SOP package with 0.50 mm pitch, 4.90 mm span with body size 3.00 X 3.00 X 1.10 mm</p> <b>SMA 50 Ohm</b> Board Thickness <b>0.062</b> Inch, End Launch Jack Receptacle<p> Johnson Components<br> Source: www.johnsoncomponents.com .. J502-ND.pdf <b><b>MHZ RANGE CRYSTASL UNIT</b></b> FA-128<p> ULTRA MINIATURE SIZE LOW PROFILE SMD<br> Source: Epson Toyocom FA128.pdf 32-QFN, 0.50 mm pitch, 5.00 X 5.00 X 0.80 mm body, 3.10 X 3.10 mm thermal pad <p>32-pin QFN package with 0.50 mm pitch with body size 5.00 X 5.00 X 0.80 mm and thermal pad size 3.10 X 3.10 mm</p> 5-SOT23, 0.95 mm pitch, 2.40 mm span, 2.90 X 1.30 X 1.10 mm body <p>5-pin SOT23 package with 0.95 mm pitch, 2.40 mm span with body size 2.90 X 1.30 X 1.10 mm</p> Chip, 2.00 X 1.25 X 1.00 mm body <p>Chip package with body size 2.00 X 1.25 X 1.00 mm</p> <b>RESISTOR</b> <b>RESISTOR</b> 8-SON (DFN), 0.50 mm pitch, 2.00 X 2.00 X 0.80 mm body, 1.60 X 0.90 mm thermal pad <p>8-pin SON (DFN) package with 0.50 mm pitch with body size 2.00 X 2.00 X 0.80 mm and thermal pad size 1.60 X 0.90 mm</p> <b>TEST PAD</b> <b>CHIPLED</b><p> Source: http://www.osram.convergy.de/ ... LG_LY Q971.pdf <b>DIODE</b> <b>DC POWER JACK</b><p> Source: DCJ0202.pdf 32-QFN, 0.50 mm pitch, 5.00 X 5.00 X 1.00 mm body, 3.45 X 3.45 mm thermal pad <p>32-pin QFN package with 0.50 mm pitch with body size 5.00 X 5.00 X 1.00 mm and thermal pad size 3.45 X 3.45 mm</p> 4-SOT223, 2.30 mm pitch, 7.00 mm span, 6.50 X 3.50 X 1.80 mm body <p>4-pin SOT223 package with 2.30 mm pitch, 7.00 mm span with body size 6.50 X 3.50 X 1.80 mm</p> <b>CAPACITOR</b> <b>PIN HEADER</b> <b>TQ144 TQG144</b> 6-SON (DFN), 0.95 mm pitch, 3.00 X 3.00 X 1.00 mm body, 2.40 X 1.70 mm thermal pad <p>6-pin SON (DFN) package with 0.95 mm pitch with body size 3.00 X 3.00 X 1.00 mm and thermal pad size 2.40 X 1.70 mm</p> 12-SON (DFN), 0.50 mm pitch, 3.00 X 3.00 X 0.90 mm body, 2.40 X 1.70 mm thermal pad <p>12-pin SON (DFN) package with 0.50 mm pitch with body size 3.00 X 3.00 X 0.90 mm and thermal pad size 2.40 X 1.70 mm</p> 8-SOP, 0.65 mm pitch, 4.90 mm span, 3.00 X 3.00 X 1.10 mm body <p>8-pin SOP package with 0.65 mm pitch, 4.90 mm span with body size 3.00 X 3.00 X 1.10 mm</p> 48-QFN, 0.50 mm pitch, 7.00 X 7.00 X 0.60 mm body, 5.60 X 5.60 mm thermal pad <p>48-pin QFN package with 0.50 mm pitch with body size 7.00 X 7.00 X 0.60 mm and thermal pad size 5.60 X 5.60 mm</p> <b>CAPACITOR</b> 12-QFN, 0.40 mm pitch, 1.80 X 1.80 X 0.55 mm body, 0.76 X 0.76 mm thermal pad <p>12-pin QFN package with 0.40 mm pitch with body size 1.80 X 1.80 X 0.55 mm and thermal pad size 0.76 X 0.76 mm</p> <b>MINI USB-B R/A SMT W/O REAR</b><p> Source: http://www.cypressindustries.com/pdf/32005-301.pdf DFN4, 1.60 X 0.84 X 0.70 mm body <p>DFN4 package with body size 1.60 X 0.84 X 0.70 mm</p> 24-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.75 mm body, 2.70 X 2.70 mm thermal pad <p>24-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.75 mm and thermal pad size 2.70 X 2.70 mm</p> 36-QFN, 0.50 mm pitch, 6.00 X 6.00 X 1.00 mm body, 4.10 X 4.10 mm thermal pad <p>36-pin QFN package with 0.50 mm pitch with body size 6.00 X 6.00 X 1.00 mm and thermal pad size 4.10 X 4.10 mm</p> 24-QFN, 0.50 mm pitch, 4.00 X 4.00 X 1.00 mm body, 2.50 X 2.50 mm thermal pad <p>24-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 1.00 mm and thermal pad size 2.50 X 2.50 mm</p> 3-SOTFL, 0.95 mm pitch, 2.40 mm span, 2.90 X 1.80 X 0.80 mm body <p>3-pin SOTFL package with 0.95 mm pitch, 2.40 mm span with body size 2.90 X 1.80 X 0.80 mm</p> 8-SON, 0.50 mm pitch, 3.00 X 3.00 X 0.80 mm body, 2.38 X 1.65 mm thermal pad <p>8-pin SON package with 0.50 mm pitch with body size 3.00 X 3.00 X 0.80 mm and thermal pad size 2.38 X 1.65 mm</p> <b>CAPACITOR</b> <b>PIN HEADER</b> >VALUE >NAME >Name >Value >VALUE >Name >Value >Name >Value >NAME >VALUE >Name >Value >Name >Value >NAME >VALUE >NAME >VALUE >VALUE INT >VALUE >NAME >VALUE GND >Name >Value >NAME >VALUE >Name >Value >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >DRAWING_NAME >LAST_DATE_TIME >SHEET Sheet: >NAME >TP_SIGNAL_NAME >VALUE >NAME >VALUE >Value >Name >Name >Value >VALUE >NAME >VALUE >NAME >VALUE GND >NAME >VALUE >VALUE >NAME >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >Name >Value >NAME >VALUE >Name >Value >Name >Value >NAME >VALUE V+ V- >Name >Value >NAME >Name >Value >NAME >VALUE >NAME >VALUE >Name >Value >Name >Value >Name >Value >Name >Value >Name >Value >Name >Value >VALUE >VALUE >VALUE >NAME >NAME >VALUE >Name >Value >NAME >VALUE >Name >Value >Name >Value >Name >Value >Name >Value π >Name >Value <b>SUPPLY SYMBOL</b> <b>SUPPLY SYMBOL</b> <b>SUPPLY SYMBOL</b> <b>SUPPLY SYMBOL</b> <b>FRAME</b><p> DIN A3, landscape with location and doc. field <b>SUPPLY SYMBOL</b> <b>SUPPLY SYMBOL</b> <b>SUPPLY SYMBOL</b> <b>SUPPLY SYMBOL</b> <b>EEPROM</b><p> 4 Mbit SPI Serial Flash7 <b>MHz RANGE CRYSTAL UNIT</b> <p> Source: Epson Toyocom <B>RESISTOR</B>, European symbol <b>Test pad</b> <b>DC POWER JACK</b><p> Source: DCJ0202.pdf <b>LED</b><p> <u>OSRAM</u>:<br> - <u>CHIPLED</u><br> LG R971, LG N971, LY N971, LG Q971, LY Q971, LO R971, LY R971 LH N974, LH R974<br> LS Q976, LO Q976, LY Q976<br> LO Q996<br> - <u>Hyper CHIPLED</u><br> LW Q18S<br> LB Q993, LB Q99A, LB R99A<br> - <u>SideLED</u><br> LS A670, LO A670, LY A670, LG A670, LP A670<br> LB A673, LV A673, LT A673, LW A673<br> LH A674<br> LY A675<br> LS A676, LA A676, LO A676, LY A676, LW A676<br> LS A679, LY A679, LG A679<br> - <u>Hyper Micro SIDELED®</u><br> LS Y876, LA Y876, LO Y876, LY Y876<br> LT Y87S<br> - <u>SmartLED</u><br> LW L88C, LW L88S<br> LB L89C, LB L89S, LG L890<br> LS L89K, LO L89K, LY L89K<br> LS L896, LA L896, LO L896, LY L896<br> - <u>TOPLED</u><br> LS T670, LO T670, LY T670, LG T670, LP T670<br> LSG T670, LSP T670, LSY T670, LOP T670, LYG T670<br> LG T671, LOG T671, LSG T671<br> LB T673, LV T673, LT T673, LW T673<br> LH T674<br> LS T676, LA T676, LO T676, LY T676, LB T676, LH T676, LSB T676, LW T676<br> LB T67C, LV T67C, LT T67C, LS T67K, LO T67K, LY T67K, LW E67C<br> LS E67B, LA E67B, LO E67B, LY E67B, LB E67C, LV E67C, LT E67C<br> LW T67C<br> LS T679, LY T679, LG T679<br> LS T770, LO T770, LY T770, LG T770, LP T770<br> LB T773, LV T773, LT T773, LW T773<br> LH T774<br> LS E675, LA E675, LY E675, LS T675<br> LS T776, LA T776, LO T776, LY T776, LB T776<br> LHGB T686<br> LT T68C, LB T68C<br> - <u>Hyper Mini TOPLED®</u><br> LB M676<br> - <u>Mini TOPLED Santana®</u><br> LG M470<br> LS M47K, LO M47K, LY M47K <p> Source: http://www.osram.convergy.de<p> <u>LUXEON:</u><br> - <u>LUMILED®</u><br> LXK2-PW12-R00, LXK2-PW12-S00, LXK2-PW14-U00, LXK2-PW14-V00<br> LXK2-PM12-R00, LXK2-PM12-S00, LXK2-PM14-U00<br> LXK2-PE12-Q00, LXK2-PE12-R00, LXK2-PE12-S00, LXK2-PE14-T00, LXK2-PE14-U00<br> LXK2-PB12-K00, LXK2-PB12-L00, LXK2-PB12-M00, LXK2-PB14-N00, LXK2-PB14-P00, LXK2-PB14-Q00<br> LXK2-PR12-L00, LXK2-PR12-M00, LXK2-PR14-Q00, LXK2-PR14-R00<br> LXK2-PD12-Q00, LXK2-PD12-R00, LXK2-PD12-S00<br> LXK2-PH12-R00, LXK2-PH12-S00<br> LXK2-PL12-P00, LXK2-PL12-Q00, LXK2-PL12-R00 <p> Source: www.luxeon.com<p> <u>KINGBRIGHT:</U><p> KA-3528ASYC<br> Source: www.kingbright.com <B>DIODE</B> <B>CAPACITOR</B>, European symbol <b>PIN HEADER</b> Xilinx FPGA: 6SLX9TQG144 <B>CAPACITOR</B>, European symbol <b>MINI USB-B Conector</b><p> Source: www.cypressindustries.com <b>PIN HEADER</b> <B>CAPACITOR</B>, European symbol 3dB pad attenuator Since Version 8.3, EAGLE supports URNs for individual library assets (packages, symbols, and devices). The URNs of those assets will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports the association of 3D packages with devices in libraries, schematics, and board files. Those 3D packages will not be understood (or retained) with this version.