+3V3
+3V3
GND
+1V8
+3V3
+6V
GND
+5V
+5V
+5V
+5V
GND
GND
GND
+1V8
+1V8
+1V8
+3V3
+3V3
+3V3
+3V3
Port 2
Port 1
Ref In
Ref Out
+12V In
TX
NRST
SWDIO
GND
SWCLK
+3V3
TMS
TDI
TDO
TCK
TCK
TDO
TDI
TMS
+3V3
SWCLK
GND
SWDIO
NRST
TX
Ref Out
Ref In
+12V In
Generated from <b>VNA.sch</b><p>
by exp-lbrs.ulp
<b>CAPACITOR</b>
>NAME
>VALUE
>NAME
>VALUE
<b>CAPACITOR</b>
>NAME
>VALUE
<b>CAPACITOR</b>
>NAME
>VALUE
<b>DIODE</b>
>NAME
>VALUE
6-SON (DFN), 0.95 mm pitch, 3.00 X 3.00 X 1.00 mm body, 2.40 X 1.70 mm thermal pad
<p>6-pin SON (DFN) package with 0.95 mm pitch with body size 3.00 X 3.00 X 1.00 mm and thermal pad size 2.40 X 1.70 mm</p>
>NAME
>VALUE
32-QFN, 0.50 mm pitch, 5.00 X 5.00 X 1.00 mm body, 3.45 X 3.45 mm thermal pad
<p>32-pin QFN package with 0.50 mm pitch with body size 5.00 X 5.00 X 1.00 mm and thermal pad size 3.45 X 3.45 mm</p>
>NAME
>VALUE
<b>DC POWER JACK</b><p>
Source: DCJ0202.pdf
>NAME
>VALUE
<b>RESISTOR</b>
>NAME
>VALUE
>Name
>Value
<b>RESISTOR</b>
>NAME
>VALUE
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.90 mm body, 2.70 X 2.70 mm thermal pad
<p>20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.90 mm and thermal pad size 2.70 X 2.70 mm</p>
>NAME
>VALUE
<b><b>MHZ RANGE CRYSTASL UNIT</b></b> FA-128<p>
ULTRA MINIATURE SIZE LOW PROFILE SMD<br>
Source: Epson Toyocom FA128.pdf
>NAME
>VALUE
<b>SMA 50 Ohm</b> Board Thickness <b>0.062</b> Inch, End Launch Jack Receptacle<p>
Johnson Components<br>
Source: www.johnsoncomponents.com .. J502-ND.pdf
>NAME
>VALUE
32-QFN, 0.50 mm pitch, 5.00 X 5.00 X 0.80 mm body, 3.10 X 3.10 mm thermal pad
<p>32-pin QFN package with 0.50 mm pitch with body size 5.00 X 5.00 X 0.80 mm and thermal pad size 3.10 X 3.10 mm</p>
>NAME
>VALUE
5-SOT23, 0.95 mm pitch, 2.40 mm span, 2.90 X 1.30 X 1.10 mm body
<p>5-pin SOT23 package with 0.95 mm pitch, 2.40 mm span with body size 2.90 X 1.30 X 1.10 mm</p>
>NAME
>VALUE
12-QFN, 0.40 mm pitch, 1.80 X 1.80 X 0.55 mm body, 0.76 X 0.76 mm thermal pad
<p>12-pin QFN package with 0.40 mm pitch with body size 1.80 X 1.80 X 0.55 mm and thermal pad size 0.76 X 0.76 mm</p>
>NAME
>VALUE
4-SOT223, 2.30 mm pitch, 7.00 mm span, 6.50 X 3.50 X 1.80 mm body
<p>4-pin SOT223 package with 2.30 mm pitch, 7.00 mm span with body size 6.50 X 3.50 X 1.80 mm</p>
>NAME
>VALUE
DFN4, 1.60 X 0.84 X 0.70 mm body
<p>DFN4 package with body size 1.60 X 0.84 X 0.70 mm</p>
>NAME
>VALUE
20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.75 mm body, 2.06 X 2.06 mm thermal pad
<p>20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.75 mm and thermal pad size 2.06 X 2.06 mm</p>
>NAME
>VALUE
24-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.75 mm body, 2.70 X 2.70 mm thermal pad
<p>24-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.75 mm and thermal pad size 2.70 X 2.70 mm</p>
>NAME
>VALUE
8-SON (DFN), 0.50 mm pitch, 2.00 X 2.00 X 0.80 mm body, 1.60 X 0.90 mm thermal pad
<p>8-pin SON (DFN) package with 0.50 mm pitch with body size 2.00 X 2.00 X 0.80 mm and thermal pad size 1.60 X 0.90 mm</p>
>NAME
>VALUE
8-SON, 0.50 mm pitch, 3.00 X 3.00 X 0.80 mm body, 2.38 X 1.65 mm thermal pad
<p>8-pin SON package with 0.50 mm pitch with body size 3.00 X 3.00 X 0.80 mm and thermal pad size 2.38 X 1.65 mm</p>
>NAME
>VALUE
>NAME
>VALUE
10-SOP, 0.50 mm pitch, 4.90 mm span, 3.00 X 3.00 X 1.10 mm body
<p>10-pin SOP package with 0.50 mm pitch, 4.90 mm span with body size 3.00 X 3.00 X 1.10 mm</p>
>NAME
>VALUE
24-QFN, 0.50 mm pitch, 4.00 X 4.00 X 1.00 mm body, 2.50 X 2.50 mm thermal pad
<p>24-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 1.00 mm and thermal pad size 2.50 X 2.50 mm</p>
>NAME
>VALUE
>NAME
>VALUE
>Name
>Value
48-QFN, 0.50 mm pitch, 7.00 X 7.00 X 0.60 mm body, 5.60 X 5.60 mm thermal pad
<p>48-pin QFN package with 0.50 mm pitch with body size 7.00 X 7.00 X 0.60 mm and thermal pad size 5.60 X 5.60 mm</p>
>NAME
>VALUE
<b>PIN HEADER</b>
>NAME
>VALUE
<b>CHIPLED</b><p>
Source: http://www.osram.convergy.de/ ... LG_LY Q971.pdf
>NAME
>VALUE
<b>TQ144 TQG144</b>
>NAME
>VALUE
<b>SMALL OUTLINE INTEGRATED CIRCUIT</b><p>
150 mil (3.9 mm) body/JEDEC MS-012AA
>NAME
>VALUE
<b>MINI USB-B R/A SMT W/O REAR</b><p>
Source: http://www.cypressindustries.com/pdf/32005-301.pdf
>NAME
>VALUE
<b>PIN HEADER</b>
>NAME
>VALUE
<b>CAPACITOR</b>
<b>CAPACITOR</b>
<b>CAPACITOR</b>
<b>DIODE</b>
6-SON (DFN), 0.95 mm pitch, 3.00 X 3.00 X 1.00 mm body, 2.40 X 1.70 mm thermal pad
<p>6-pin SON (DFN) package with 0.95 mm pitch with body size 3.00 X 3.00 X 1.00 mm and thermal pad size 2.40 X 1.70 mm</p>
32-QFN, 0.50 mm pitch, 5.00 X 5.00 X 1.00 mm body, 3.45 X 3.45 mm thermal pad
<p>32-pin QFN package with 0.50 mm pitch with body size 5.00 X 5.00 X 1.00 mm and thermal pad size 3.45 X 3.45 mm</p>
<b>DC POWER JACK</b><p>
Source: DCJ0202.pdf
<b>RESISTOR</b>
<b>RESISTOR</b>
<b>TEST PAD</b>
20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.90 mm body, 2.70 X 2.70 mm thermal pad
<p>20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.90 mm and thermal pad size 2.70 X 2.70 mm</p>
<b><b>MHZ RANGE CRYSTASL UNIT</b></b> FA-128<p>
ULTRA MINIATURE SIZE LOW PROFILE SMD<br>
Source: Epson Toyocom FA128.pdf
<b>SMA 50 Ohm</b> Board Thickness <b>0.062</b> Inch, End Launch Jack Receptacle<p>
Johnson Components<br>
Source: www.johnsoncomponents.com .. J502-ND.pdf
32-QFN, 0.50 mm pitch, 5.00 X 5.00 X 0.80 mm body, 3.10 X 3.10 mm thermal pad
<p>32-pin QFN package with 0.50 mm pitch with body size 5.00 X 5.00 X 0.80 mm and thermal pad size 3.10 X 3.10 mm</p>
5-SOT23, 0.95 mm pitch, 2.40 mm span, 2.90 X 1.30 X 1.10 mm body
<p>5-pin SOT23 package with 0.95 mm pitch, 2.40 mm span with body size 2.90 X 1.30 X 1.10 mm</p>
12-QFN, 0.40 mm pitch, 1.80 X 1.80 X 0.55 mm body, 0.76 X 0.76 mm thermal pad
<p>12-pin QFN package with 0.40 mm pitch with body size 1.80 X 1.80 X 0.55 mm and thermal pad size 0.76 X 0.76 mm</p>
4-SOT223, 2.30 mm pitch, 7.00 mm span, 6.50 X 3.50 X 1.80 mm body
<p>4-pin SOT223 package with 2.30 mm pitch, 7.00 mm span with body size 6.50 X 3.50 X 1.80 mm</p>
DFN4, 1.60 X 0.84 X 0.70 mm body
<p>DFN4 package with body size 1.60 X 0.84 X 0.70 mm</p>
20-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.75 mm body, 2.06 X 2.06 mm thermal pad
<p>20-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.75 mm and thermal pad size 2.06 X 2.06 mm</p>
24-QFN, 0.50 mm pitch, 4.00 X 4.00 X 0.75 mm body, 2.70 X 2.70 mm thermal pad
<p>24-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 0.75 mm and thermal pad size 2.70 X 2.70 mm</p>
8-SON (DFN), 0.50 mm pitch, 2.00 X 2.00 X 0.80 mm body, 1.60 X 0.90 mm thermal pad
<p>8-pin SON (DFN) package with 0.50 mm pitch with body size 2.00 X 2.00 X 0.80 mm and thermal pad size 1.60 X 0.90 mm</p>
8-SON, 0.50 mm pitch, 3.00 X 3.00 X 0.80 mm body, 2.38 X 1.65 mm thermal pad
<p>8-pin SON package with 0.50 mm pitch with body size 3.00 X 3.00 X 0.80 mm and thermal pad size 2.38 X 1.65 mm</p>
10-SOP, 0.50 mm pitch, 4.90 mm span, 3.00 X 3.00 X 1.10 mm body
<p>10-pin SOP package with 0.50 mm pitch, 4.90 mm span with body size 3.00 X 3.00 X 1.10 mm</p>
24-QFN, 0.50 mm pitch, 4.00 X 4.00 X 1.00 mm body, 2.50 X 2.50 mm thermal pad
<p>24-pin QFN package with 0.50 mm pitch with body size 4.00 X 4.00 X 1.00 mm and thermal pad size 2.50 X 2.50 mm</p>
48-QFN, 0.50 mm pitch, 7.00 X 7.00 X 0.60 mm body, 5.60 X 5.60 mm thermal pad
<p>48-pin QFN package with 0.50 mm pitch with body size 7.00 X 7.00 X 0.60 mm and thermal pad size 5.60 X 5.60 mm</p>
<b>PIN HEADER</b>
<b>CHIPLED</b><p>
Source: http://www.osram.convergy.de/ ... LG_LY Q971.pdf
<b>TQ144 TQG144</b>
<b>SMALL OUTLINE INTEGRATED CIRCUIT</b><p>
150 mil (3.9 mm) body/JEDEC MS-012AA
<b>MINI USB-B R/A SMT W/O REAR</b><p>
Source: http://www.cypressindustries.com/pdf/32005-301.pdf
<b>PIN HEADER</b>
<b>EAGLE Design Rules</b>
<p>
Die Standard-Design-Rules sind so gewählt, dass sie für
die meisten Anwendungen passen. Sollte ihre Platine
besondere Anforderungen haben, treffen Sie die erforderlichen
Einstellungen hier und speichern die Design Rules unter
einem neuen Namen ab.
<b>EAGLE Design Rules</b>
<p>
The default Design Rules have been set to cover
a wide range of applications. Your particular design
may have different requirements, so please make the
necessary adjustments and save your customized
design rules under a new name.
Since Version 8.2, EAGLE supports online libraries. The ids
of those online libraries will not be understood (or retained)
with this version.
Since Version 8.3, EAGLE supports Fusion synchronisation.
This feature will not be available in this version and saving
the document will break the link to the Fusion PCB feature.
Since Version 8.3, EAGLE supports URNs for individual library
assets (packages, symbols, and devices). The URNs of those assets
will not be understood (or retained) with this version.
Since Version 8.3, EAGLE supports the association of 3D packages
with devices in libraries, schematics, and board files. Those 3D
packages will not be understood (or retained) with this version.