46 lines
1.7 KiB
Plaintext
46 lines
1.7 KiB
Plaintext
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******************************************************************************
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* @file readme.txt
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* @author MCD Application Team
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* @version 2.0
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* @date 04-December-2020
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* @brief MB1367C board design files package
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******************************************************************************
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* COPYRIGHT(c) 2020 STMicroelectronics
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*
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* The Open Platform License Agreement (<28>Agreement<6E>) is a binding legal contract
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* between you ("You") and STMicroelectronics International N.V. (<28>ST<53>), a
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* company incorporated under the laws of the Netherlands acting for the purpose
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* of this Agreement through its Swiss branch 39, Chemin du Champ des Filles,
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* 1228 Plan-les-Ouates, Geneva, Switzerland.
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*
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* By using the enclosed reference designs, schematics, PC board layouts, and
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* documentation, in hardcopy or CAD tool file format (collectively, the
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* <20>Reference Material<61>), You are agreeing to be bound by the terms and
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* conditions of this Agreement. Do not use the Reference Material until You
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* have read and agreed to this Agreement terms and conditions. The use of
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* the Reference Material automatically implies the acceptance of the Agreement
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* terms and conditions.
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*
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* The complete Open Platform License Agreement can be found on www.st.com/opla.
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******************************************************************************
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========================
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* History
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========================
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* 2.0 - 04-December-2020
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------------------------
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+ Added G491RE variant.
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* 1.0 - 17-June-2019
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------------------------
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+ First official release.
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========================
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* Package content
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========================
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******************* (C) COPYRIGHT 2020 STMicroelectronics *****END OF FILE
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